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2015 2nd International Conference on Communication and Signal  Processing
Chengdu, China Oct.10-11, 2015

 

Welcome to the official website of the 2015 2nd International Conference on Communication and Signal  Processing, ICCSP 2015, will be held during October 10-11, 2015, in Chengdu, China. ICCSP 2015, aims to bring together researchers, scientists, engineers, and scholar students to exchange and share their experiences, new ideas, and research results about all aspects of Communication and Signal  Processing, and discuss the practical challenges encountered and the solutions adopted.
 

The conference will be held every year to make it an ideal platform for people to share views and experiences in Information Technology and related areas.
 

All full paper submissions will be peer reviewed and evaluated based on originality, technical and/or research content/depth, correctness, relevance to conference, contributions, and readability.

 

All accepted papers of ICCSP 2015 will be published in the volume of MATEC Web of Conferences (ISSN: 2261-236X), which is indexed by Ei Compendex, Inspec, DOAJ, CPCI (Web of Science) and Scopus.

 

所有的会议论文将出版在论文集,被EI Compendex 检索。检索失败,将全额退款。

 

 


 

Journal of Communications
 

(JCM, ISSN:1796-2021;DOI: 10.12720/jcm)

 

EI Compendex; SCOPUS; ULRICH's Periodicals Directory; Google Scholar; INSPEC;etc.

 

                           


 

International Journal of Signal Processing Systems

 

(IJSPS, ISSN:2315-4535;DOI: 10.12720/ijsps)


 

Ulrich's Periodicals Directory, Google Scholar, EBSCO, Engineering & Technology Digital Library and Electronic Journals Digital Library

 

 

 

committees

Prof. Maode Ma Prof. S.Arumuga perumal Dr Raj Das Prof. Syed A. R. Abu-Bakar

Prof.

Dr. M. Arun

 

Assoc. Prof.

Hatim Mohamad Tahir

 

Prof. Ann Nowé Dr. Nor Hisham

bin Haji Khamis

 

Dr. Hajjah

Rathiah bt. Hashim

 

Dr. Nasiroh Omar

Assoc. Prof. Nirlakalla. Ravi Head &

Asst. Prof.Mamatha H.R

Prof. Ho-Ting Wu

 National Taipei University of Technology, Taiwan

Assoc. Prof. Hongyuan Gao

Harbin
 Engineering University, China

Assoc. Prof. Ting Cheng,

University of Electronic Science and Technology of China

Prof. Bin Tang,

University of Electronic Science and Technology of China